Highlights:17+ years of semiconductor industries professional. Worked for TEL Shanghai for FSE and FAE Worked for STMicroelectronics Singapore for Litho process engineer Worked for Intel Dalian China for Senior C4 litho process equipment engineer Worked for KINGSEMI Co Ltd for semiconductor equipment R&D technical engineering Worked for Qorvo China as equipment engineering to setup new bumping production line in Dezhou China

Skills:lihto, photo,, semiconductor equipment, semiconductor process, New equipment setup and qualification, Process transfer, Line sustaining process/equipment, 8D, SPC, FMEA, DOE, wafer fab, equipment transfer

Goal:Semiconductor FAB equipment engineer, process engineer, technicians Semiconductor equipment supplier Feild Service Engineer, Field Application Engineer Technical job in university and etc

Membership:NA

Certification:Bachelor of Engineering of East China University of Science and Technology

Honor:MVE(Most Valuable Employee) of the year 2003 of Tokyo Electron Shanghai Ltd.

Equipment Engineering Manager 10/2015 - current
Qorvo Inc, Dezhou, Shandong China
Industry: Semiconductor
Qorvo new bumping line setup and qualification
1. Setup and initialize equipment engineering department for new semiconductor advanced packaging production line in Dezhou, Shandong. Hiring and coaching the team. 2. Work with Qorvo US IE to layout design for Dezhou equipment and PM/operation related stuff. 3. To plan and calculate Qorvo Dezhou capacity expansion installation, based on corporate strategy and US factory data. 4. Lead a team to accomplish equipment engineering technical transfer from Oorvo Oregon (USA) to Dezhou (China). 5. Lead all automatic equipment purchasing, technical negotiation and equipment specification provision documentation agreement signature for whole production line. The equipment includes: PVD sputter, O2 Plasma, Laminator, Exposure, De-taper, Plater, Photoresist Stripper, UBM Etcher, Mask Cleaner, Spin Rinse Drier, AOI 3D measurement, Profiler, Four-Point Prober, Shear Tester, Chemical Analyzer, Film Thickness Measurement and etc. 6. Work with facility engineering and EPC vendor to complete government environmental evaluation process. And cleanroom innovation as well. Including water, power, gas, exhaust, waste treatment design input, whole production line, hookup design input and FSS (Fire Suspension System) design input. 7. Lead team to work closely with equipment Suppliers to finish equipment pre-move in, move in, hookup, installation and qualification, equipment buyoff. 8. Work with IT department and equipment Supplier for FAB automation approach. 9. Work with process engineering department for equipment process qual and product qual. 10. TPM and PM (Preventative Maintenance) scheduler, procedure and training. 11. Modeling OEE (Overall Equipment Effectiveness). KPI includes but not limit to uptime, MTBF, MTTR, Throughput, cycle time. 12. Department budget for whole Financial Year.--
Technical Manager 09/2010 - 10/2015
KINGSEMI Co. Ltd., Shenyang, Liaoning China
Industry: Semiconductor
Bumping, Front end FAB use coater/developer R&D, Manufacturing and Application
1.Semiconductor equipment R&D experience. More deep understanding on advanced equipment. 2. Advanced semiconductor manufacturing equipment-coater, developer, single wafer wet etcher, clenaer and scrubber R&D and application and marketing. 3. 10 direct report GL (Group Leader). Include machine main frame and system design group, spin unit group, heat treatment unit group, software group, electrical control group, process application group, Field Service group, IP group, standardization group, lab. 4. Manage a CNY40m fix asset lab. To satisfy product R&D, customer demo requirement with a timely, high-quality manner. Lab 6S and JIT management. 5. Work very close with manufacturing department to realize the new design implementation to shorten the R&D and product to market lead time. 6. Tech support to corporate sales for technical negotiations. To safeguard corporate interest. 7. Core member of nation 02 project. Project management experience inside and cross companies. Had ever worked with XMC, SIA, SMEE, ICRD, Tsing Hua University and etc. 8. Hiring, staffing, team building, team coaching. 9. Department budget and cost control.--
C4 litho Senior process equipment engineer 10/2008 - 09.2010
Intel, Dalian, Liaoning China
Industry: Semiconductor
Seed engineer for C4 Litho process. Transfer C4 litho equipment and process from Ireland to Dalian, China.
Transfer Intel CPU Chipset C4 litho process and equipment to Dalian. 1. As first batch of seed engineer lead, relocated to Intel Ireland (FAB24) for 1 year to finish preparing litho equipment and process transfer. 2. In charge of wet process and equipment transfer. Including litho and related metrology equipment and process. 3. When in Ireland: Reference tool selection, machine/process parameter and process recipe transfer, specification transfer, control plan transfer, test vehicle preparation, PM training, PM scheduling, PM procedure, equipment hard down recovery, product excursion treatment, SPC control and etc. 4. When back in Dalian: Work closely with equipment supplier and facility for equipment IQ (Installation and Qualification) and buyoff, complete RTM (Reference Tool Matching), MT training, product pipe clean, risk production and mass production. 5. Line sustaining jobs. FAB yield improvement, equipment OEE improvement and CoO deduction and etc.--
Litho process engineer 12/2003 - 09/2008
STMicroelectronics, Singapore, Singapore Singapore
Industry: Semiconductor
Microcontroller and EEPROM technology transfer, line setup, process qualificarion, ramp up, sustaining
Litho technology transfer from STMicroelectronics France to Singapore. 2. Early stage: 2.1 As lead engineer in a pioneer, had been assigned to STMicroelectronics France. Be responsible for EEPROM and Micro-controller technology transfer to Singapore factory for litho process. 2.2 When in France: Reference tool selection, machine POR parameter and recipe collection/transfer, control plan transfer, quality task transfer and test vehicle preparation. 2.3 When back in Singapore factory: reference tool matching, SOP/OCAP/Quality Task implementation? 2.4 Work closely with equipment and material supplier to optimize equipment performance to realize best performance tool matching. 2.5 To validate products transfer by first path finder lot run, short loop test run, first full loop test run. 3. Middle stage: 3.1 Work closely with PIE to get improve E-test and FAB yield by thousands of DOE, Data analysis and FA. 3.2 Work closely with process control department to improve products FAB yield. Including defect deduction, CpK improvement, rework deduction and etc. 4. Later stage: 4.1 Factory ramp up to more than 8 times. 4.2 Work with equipment engineering, equipment supplier, material supplier to improve equipment OEE, reduce CoO. 4.3 Work with IE to improve product cycle time. 4.1 Work in a CIP team to get a lean manufacturing FAB.--
Field Service Engineer 02/2001 - 12/2003
Tokyo Electron Ltd, Shanghai, Shanghai China
Industry: Semiconductor
Field service engineer for coater/developer Field application engineer for coater/developer
1. Career start from FSE (Field Service Engineer). Had ever been installed 10+ litho capital equipment on multiple customer sites. On site on-call, trouble-shooting and PM experience. 2. People recruitment, establish Field Application Team. 3. Work closely with customer engineers and managers to optimize litho through-put, CpK improvement and CoO deduction by DOE, Data analysis and FA and etc. 4. Contact at all level to technical negotiation with customer during pre-sales, sales and after sales.--
Equipment Engineer 07/1999 - 01/2001
Shanghai Aero Engine Manufacturing Plant, Shanghai , Shanghai China
Industry: Aero
Equipment engineer for inner gear pump manufacturing
1. 1year machining intern for milling machine, planning machine, grinding machine, lathe, fitter and welding. 2. Hands-on machining tools maintenance and repair.--

East China University of Science and Technology 09/1995 - 07/1999
Shanghai, Shanghai, China
Degree: Bachelor's Degree
Major:Mechatronics
Bachelor of Engineering

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